MetaLIGHT 2300

High Density Aggregation Switch Supporting
Hybrid Networks of Fiber and Copper

High Density Aggregation Switch Supporting Hybrid Networks of Fiber and Copper

Compact, next-generation Ethernet aggregation
platform delivering high-speed Ethernet services

Compact, next generation Ethernet aggregation platform delivering high-speed Ethernet services

7 port managed switch

The MetaLight 2300 Ethernet Aggregation switch delivers unprecedented Rate, Reach and Reliability over existing twisted pair copper or fiber lines, enabling wide-scale deployment of Ethernet services and infrastructure. Architecturally, the ML2300 platform serves as a Central Office (CO) aggregator in a Point-to-Multipoint topology connecting to multiple fiber ethernet switches, copper switches, or hybrid fiber-copper switches.

For copper deployments, each Actelis copper or hybrid fiber-copper ethernet switch is connected to the ML2300 via a High-Speed Link (HSL) comprising 1-16 bonded copper pairs and offering up to 230 Mbps per HSL. A number of ML2300 systems can be stacked in a Star or Ring topology, providing flexible topology layouts and higher port density per uplink. To meet higher bandwidth and/or reach requirements, the Actelis ML230 can be used as an Ethernet Access Device bonding up to 32 pairs per HSL, offering more than 400 Mbps per HSL. The ML2300 HSLs can be used both for aggregation and service distribution.

The ML2300 is available with front and rear access options and installs within minutes, enabling immediate deployment of broadband services. The ML2300 offers a density of up to 64 ports per Rack unit (RU). The ML2300 is interoperable with any standard Ethernet switch or router and aligned with Metro Ethernet Forum (MEF) recommendations, enabling Actelis systems to seamlessly integrate into carrier Ethernet networks.

2.5 Gbps needle

1 Gbps and 2.5 Gbps
Fiber Ports

Ethernet Port Density

64 Ports
per Rack Unit

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Harsh
Environments

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High Reliability &
Availability

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Ultra-
secure

Key Features
ML2300 Ethernet Aggregation Switch

Applications

High Density Ethernet Aggregation
Over Networks of Fiber and Copper

Product Name
High Level Description
ML2300
64 Port per Rack Hybrid Fiber/Copper Ethernet Aggregation Switch 
2.5G Uplink over fiber
Ethernet (Network/User) No. of interfaces SDU model dependant:

10/100Base-T Ports: RJ45, Auto-MDIX
100/1000Base-T (option): RJ45, Auto-MDIX
1000/2500Base-FX (option): SFP based, MSA compliant
High Speed Links (max): 64/128 (SDU-440/SDU-450 series)
Copper Pairs per HSL: 1-16 with ML600; 1-32 with ML2300/ML230
Bandwidth per HSL: 1-230 Mbps w/ML600; Exceeding 400 Mbps w/ML230 SDU-450
Extended Temperature: -40°C ~ 65°C (-40°F ~ 149°F)
Power Inputs: -48/-60 VDC nominal, dual A+B

Summary of Specifications

  • Max copper pairs (chasis connectors): 256
  • Slots 6: 1-2 x SDU, 1-4 x MLU
  • Redundancy: Ethernet Facility redundancy
    SDU Equipment protection, Modem port/pair
    redundancy, Power input redundancy,
    Dual star backplane
  • End-to-End Delay: 2-4 ms (typical) Construction
      •  
  • Ethernet (Network/User) No. of interfaces SDU model dependant
    • 10/100Base-T Ports: RJ45, Auto-MDIX
    • 100/1000Base-T (option): RJ45, Auto-MDIX
    • 1000/2500Base-FX (option): SFP based, MSA compliant
  • High Speed Link ((Bonded Copper Pair Link):
    • HSLs (max): 64/128 (SDU-440/SDU-450 series)
    • Protocol: IEEE 802.3ah 2Base-TL
    • Linecode: ITU-T G.991.2 rev. 2
    • Copper Pairs per HSL: 1-16 with ML600;
      1-32 with ML2300/ML230
    • Bandwidth per HSL: 1-230 Mbps w/ML600
      Exceeding 400 Mbps w/ML230 SDU-450
    • Connector: 1x DIN 128-pin, rear access, per slot
      64-pairs FCI Connector for front access MLU-
      32/64DF cards
    • Cross-talk Cancellation – Symmetrical Vectoring
      Dynamic Rate Boost (DRB).
      (DRB friendly for HSL bonding more than 8 pairs)
    • Spectral Compliance: ITU-T G.991.2 (Annex A,
      B, F, G); ETSI TS 101 524 (Annex E); ANSI T1.417,
      T1.426; Per country regulatory compliant spectral
      modes
    • Spectral Friendliness:
      Dynamic Spectral Shaping (DSS)
    • Sealing (Wetting) Current: 48V/1.5mA nominal
      (Note: Sealing current will not be supported on Add-Drop
      configurations)
    • Copper Pair Testing Tools
      • Time Domain Reflectometer: Loop length
        measurement, fault types identifications (presence
        & location)
      • External Metallic Loop Testing: 2 x RJ45
        connectors, any copper pair Physical Characteristics
    • Management (Out-of-Band)
      • 10/100Base-T: Connector: RJ45, Auto-MDIX
      • Craft: EIA RS-232 (DCE) Connector: DB9
      • Dial-up Modem: EIA RS-232 (DTE)
        Connector: DB9
      • Alarm Contacts: 4 Input; 4 Output
        Connector: DB15 and Wire-wrap
  • Dynamic Bridging: IEEE 802.1
  • VLAN Tagging: IEEE 802.1Q
  • Double Tagging: Q-in-Q, VMAN
  • IGMP Snooping: IGMP v1/v2 (SDU-450 series)
  • RSTP, STP: IEEE 802.1d
  • Link Aggregation: IEEE 802.3ad
  • ERPS: ITU-T G.8032, Multiple Rings
  • Provider Bridges: IEEE 802.1ad
  • LLDP: IEEE 802.1ab
  • Classes of Service: 2K queues per system
  • Scheduler: 4SP, WFQ in each SP
  • Queue Management: Tail Drop
  • Classification: Port/L2 802.1p/Q priorities
  • Protocols
    • SNMP: SNMP V3, V2C, V1
    • IP addresses: IPV4 and IPV6
    • Command Line Interface: TL1, CLI
    • Remote Access: Telnet
    • Secure Access (option): SSH v2
    • Time Synchronization: SNTP v3
    • Radius Authentication: RFC 2856
    • Web Access: HTTP
    • File Transfer: FTP, TFTP
    • EFM OAM: IEEE 802.3ah clause 57
    • CFM & Service OAM: IEEE 802.3ag; ITU Y.1731
  • Applications
    • EMS: MetaASSIST™ EMS
    • Craft GUI: MetaASSIST™ View
  • System
    • Power A/B
    • Critical, Major, Minor, HSL/FAN, Alarm
    • ACO (Alarm Cut-Off) / LMT (Lamp Test) Button
  • Card
    • Active Status
    • ACT (Activity) /LNK (Link), Per Ethernet port
  • Chassis: 19” (CHS-2000/B), ETSI (CHS-2000)
  • Mounting Rack: 19”, 23” or ETSI rack
  • Dimensions
    • Height: 7” / 178mm (4U) or 225 mm (for ETSI chassis)
    • Depth: 12” / 305mm or 11”/ 280 mm (for ETSI chassis)
    • Width: 17.32” / 440 mm
  • Weight: 15.0 lbs/ 6.8 Kg (chassis only)
  • Plug-in Cards: 6 horizontal, front loading
  • Power DC: -48/-60 VDC nominal, dual A+B 140 Watt min configuration (1x SDU,1xMLU-64); 380 Watt, full chassis w/o SDU redundancy (1x SDU, 4x MLU-64); 405 Watt for fully loaded system WITH (2x SDU, 4x MLU-64)
  • Operating Temp.: -40° to +65°C (-40° to 149°F)
  • Storage Temp.:  -40° to +75°C (-40° to 167°F)
  • Relative humidity: Up to 95%, non-cond.
  • Metro Ethernet Forum: CE 2.0, CE 1.0 – MEF 9, 10, 14 
  • Safety:
    • UL 60950, CSA C22.2 60950;
      EN 60950, IEC 60950
  • EMC: 
    • FCC Part 15 Class A; ICES-003 Class A;
      ETSI EN 300 386;
      ETSI ETS 300 132-2; ITU-T K.20
  • NEBS
    • Level III (GR-1089-CORE, GR-63-CORE)
  • CE: EMC and Safety
  • Environmental:
    • GR-63-CORE; ETSI ETS 300 019

Data Sheet

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Learn More About Actelis'
Ethernet Aggregation Solutions

Learn More About Actelis' Ethernet Aggregation Solutions