MetaLIGHT 2300
High Density Aggregation Switch Supporting
Hybrid Networks of Fiber and Copper
High Density Aggregation Switch Supporting Hybrid Networks of Fiber and Copper
Compact, next-generation
Ethernet aggregation
platform delivering high-speed
Ethernet services
Compact, next generation Ethernet aggregation platform delivering high-speed Ethernet services
The MetaLight 2300 Ethernet Aggregation switch delivers unprecedented Rate, Reach and Reliability over existing
twisted pair copper or fiber lines, enabling wide-scale deployment of Ethernet services
and infrastructure. Architecturally, the ML2300 platform serves as a Central Office (CO)
aggregator in a Point-to-Multipoint topology connecting to multiple fiber ethernet switches, copper switches, or hybrid fiber-copper switches.
For copper deployments, each Actelis copper or hybrid fiber-copper ethernet switch is connected to the
ML2300 via a High-Speed Link (HSL) comprising 1-16 bonded copper
pairs and offering up to 230 Mbps per HSL. A number of ML2300
systems can be stacked in a Star or Ring topology, providing flexible
topology layouts and higher port density per uplink. To meet higher
bandwidth and/or reach requirements, the Actelis ML230 can be used
as an Ethernet Access Device bonding up to 32 pairs per HSL, offering more than 400
Mbps per HSL. The ML2300 HSLs can be used both for aggregation
and service distribution.
The ML2300 is available with front and rear access
options and installs within minutes, enabling immediate deployment
of broadband services. The ML2300 offers a density of up to 64 ports
per Rack unit (RU). The ML2300 is interoperable with any standard
Ethernet switch or router and aligned with Metro Ethernet Forum (MEF)
recommendations, enabling Actelis systems to seamlessly integrate into
carrier Ethernet networks.
1 Gbps and 2.5 Gbps
Fiber Ports
64 Ports
per Rack Unit
Harsh
Environments
High Reliability &
Availability
Ultra-
secure
Key Features
ML2300 Ethernet Aggregation Switch
- Aggregates traffic in fiber networks, copper networks, and hybrid-fiber networks
- Superior Rate, Reach & Reliability through EFMplus and DRB
- Rapid Service Deployment
- Environmentally Hardened
- IEEE 802.3ah Ethernet in the First Mile (EFM) 2Base-TL Solution
- CE 2.0, CE 1.0 - MEF 9, 10, 14
- Carrier-Class Redundancy
- Carrier-Class OAM
- Low Delay and Jitter for Voice and Video Transmission
- Worldwide Spectral Compliancy
- NEBS III, FCC, UL, CE
Applications
- DSLAM Backhaul
- WiFi and Cellular Backhaul
- Fast Internet Access
- MDU/MTU Backhaul
- Metro Ethernet Extension
- Intelligent Traffic Systems
- Private Campus Network Intra-Connection
- Transparent LAN Service
Markets Served
- Telecommunications Operators (Residential Broadband, Business Ethernet)
- Federal Government Agencies & Military
- State & Local Government Agencies
- Intelligent Traffic Solutions
- Freight and Passenger Railway Networks
- IoT Enabled Sites & Campuses
- Education
- Health Care
- Utilities
High Density Ethernet Aggregation
Over Networks of Fiber and Copper
Product Name | High Level Description |
---|---|
ML2300 | 64 Port per Rack Hybrid Fiber/Copper Ethernet Aggregation Switch 2.5G Uplink over fiber Ethernet (Network/User) No. of interfaces SDU model dependant: 10/100Base-T Ports: RJ45, Auto-MDIX 100/1000Base-T (option): RJ45, Auto-MDIX 1000/2500Base-FX (option): SFP based, MSA compliant High Speed Links (max): 64/128 (SDU-440/SDU-450 series) Copper Pairs per HSL: 1-16 with ML600; 1-32 with ML2300/ML230 Bandwidth per HSL: 1-230 Mbps w/ML600; Exceeding 400 Mbps w/ML230 SDU-450 Extended Temperature: -40°C ~ 65°C (-40°F ~ 149°F) Power Inputs: -48/-60 VDC nominal, dual A+B |
Summary of Specifications
- Max copper pairs (chasis connectors): 256
- Slots 6: 1-2 x SDU, 1-4 x MLU
- Redundancy: Ethernet Facility redundancy
SDU Equipment protection, Modem port/pair
redundancy, Power input redundancy,
Dual star backplane - End-to-End Delay: 2-4 ms (typical) Construction
- Ethernet (Network/User) No. of interfaces SDU model dependant
- 10/100Base-T Ports: RJ45, Auto-MDIX
- 100/1000Base-T (option): RJ45, Auto-MDIX
- 1000/2500Base-FX (option): SFP based, MSA compliant
- High Speed Link ((Bonded Copper Pair Link):
- HSLs (max): 64/128 (SDU-440/SDU-450 series)
- Protocol: IEEE 802.3ah 2Base-TL
- Linecode: ITU-T G.991.2 rev. 2
- Copper Pairs per HSL: 1-16 with ML600;
1-32 with ML2300/ML230 - Bandwidth per HSL: 1-230 Mbps w/ML600
Exceeding 400 Mbps w/ML230 SDU-450 - Connector: 1x DIN 128-pin, rear access, per slot
64-pairs FCI Connector for front access MLU-
32/64DF cards - Cross-talk Cancellation – Symmetrical Vectoring
Dynamic Rate Boost (DRB).
(DRB friendly for HSL bonding more than 8 pairs) - Spectral Compliance: ITU-T G.991.2 (Annex A,
B, F, G); ETSI TS 101 524 (Annex E); ANSI T1.417,
T1.426; Per country regulatory compliant spectral
modes - Spectral Friendliness:
Dynamic Spectral Shaping (DSS) - Sealing (Wetting) Current: 48V/1.5mA nominal
(Note: Sealing current will not be supported on Add-Drop
configurations) - Copper Pair Testing Tools
- Time Domain Reflectometer: Loop length
measurement, fault types identifications (presence
& location) - External Metallic Loop Testing: 2 x RJ45
connectors, any copper pair Physical Characteristics
- Time Domain Reflectometer: Loop length
- Management (Out-of-Band)
- 10/100Base-T: Connector: RJ45, Auto-MDIX
- Craft: EIA RS-232 (DCE) Connector: DB9
- Dial-up Modem: EIA RS-232 (DTE)
Connector: DB9 - Alarm Contacts: 4 Input; 4 Output
Connector: DB15 and Wire-wrap
- Dynamic Bridging: IEEE 802.1
- VLAN Tagging: IEEE 802.1Q
- Double Tagging: Q-in-Q, VMAN
- IGMP Snooping: IGMP v1/v2 (SDU-450 series)
- RSTP, STP: IEEE 802.1d
- Link Aggregation: IEEE 802.3ad
- ERPS: ITU-T G.8032, Multiple Rings
- Provider Bridges: IEEE 802.1ad
- LLDP: IEEE 802.1ab
- Classes of Service: 2K queues per system
- Scheduler: 4SP, WFQ in each SP
- Queue Management: Tail Drop
- Classification: Port/L2 802.1p/Q priorities
- Protocols
- SNMP: SNMP V3, V2C, V1
- IP addresses: IPV4 and IPV6
- Command Line Interface: TL1, CLI
- Remote Access: Telnet
- Secure Access (option): SSH v2
- Time Synchronization: SNTP v3
- Radius Authentication: RFC 2856
- Web Access: HTTP
- File Transfer: FTP, TFTP
- EFM OAM: IEEE 802.3ah clause 57
- CFM & Service OAM: IEEE 802.3ag; ITU Y.1731
- Applications
- EMS: MetaASSIST™ EMS
- Craft GUI: MetaASSIST™ View
- System
- Power A/B
- Critical, Major, Minor, HSL/FAN, Alarm
- ACO (Alarm Cut-Off) / LMT (Lamp Test) Button
- Card
- Active Status
- ACT (Activity) /LNK (Link), Per Ethernet port
- Chassis: 19” (CHS-2000/B), ETSI (CHS-2000)
- Mounting Rack: 19”, 23” or ETSI rack
- Dimensions
- Height: 7” / 178mm (4U) or 225 mm (for ETSI chassis)
- Depth: 12” / 305mm or 11”/ 280 mm (for ETSI chassis)
- Width: 17.32” / 440 mm
- Weight: 15.0 lbs/ 6.8 Kg (chassis only)
- Plug-in Cards: 6 horizontal, front loading
- Power DC: -48/-60 VDC nominal, dual A+B 140 Watt min configuration (1x SDU,1xMLU-64); 380 Watt, full chassis w/o SDU redundancy (1x SDU, 4x MLU-64); 405 Watt for fully loaded system WITH (2x SDU, 4x MLU-64)
- Operating Temp.: -40° to +65°C (-40° to 149°F)
- Storage Temp.: -40° to +75°C (-40° to 167°F)
- Relative humidity: Up to 95%, non-cond.
- Metro Ethernet Forum: CE 2.0, CE 1.0 – MEF 9, 10, 14
- Safety:
- UL 60950, CSA C22.2 60950;
EN 60950, IEC 60950
- UL 60950, CSA C22.2 60950;
- EMC:
- FCC Part 15 Class A; ICES-003 Class A;
ETSI EN 300 386;
ETSI ETS 300 132-2; ITU-T K.20
- FCC Part 15 Class A; ICES-003 Class A;
- NEBS
- Level III (GR-1089-CORE, GR-63-CORE)
- CE: EMC and Safety
- Environmental:
- GR-63-CORE; ETSI ETS 300 019